Modefine 3D High temp gold PEI build plate for X1, P1, A1 series

This gold PEI building board is textured on both sides for better first layer adhesion. This means that 3D prints stay in place better during printing and you do not have to use adhesives for all materials. When the plate has cooled, prints can be easily removed. You can also bend the plate slightly to release the model. The building board can be used for different filaments such as PLA, TPU and PC, or for materials that require a high temperature such as ABS and Nylon. This printed circuit board is suitable for the X1, P1 and A1 series of Bambu Lab.